Seica is pleased to announce that visitors to Productronica China will be able see the latest, leading-edge test solutions at their Booth 5240.

Seica’s experience in the field of testing, combined with the competence of Seica China specialized engineering team, represent a great opportunity to receive comprehensive information about Seica Flying Probe systems, in particular the PILOT VX Platform and the double side Pilot V8 Next. On display at booth 5240 also Rapid H8, the horizontal flying probe test system designed specifically for testing any type of printed circuit board from simple single sided circuits, to complex multi layers, inner-layers and ceramics.

The Pilot V8 Next is the complete solution for those who want elevate performance like high test speed, low to medium volumes, test coverage and flexibility, for prototyping, manufacturing, or repairing any type of board. Its vertical architecture is the optimum solution for probing both sides of the UUT simultaneously. The Pilot V8 Next is equipped with 8 electrical flying test probes (4 on each side), 2 Openfix flying probes (1 on each side), 4 Flying Pods (2 front, 2 rear) and 2 CCD cameras (1 on each side), 2 Thermal Scan sensors, 2 Laser sensors, 2 LED Sensors, for a total of 20 mobile resources available to test the UUT.

The Pilot VX Next raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment. One major concern is cost, and since time is cost a reduction of up to 50% in test time due to the new state-of-the-art mechanical performance and motion control saves you money. The Pilot VX has 12 multi-function test heads providing the capability to contact up to 44 points simultaneously, technologically advanced measurement hardware, new microwave-based measurement techniques and optimized VIVA software enables the parallelization of different types of tests, saving even more time.

The Rapid H8 is equipped with 8 completely independent mobile probes that can position on the same pad (4 on each side). Thanks to the third generation of linear guide technology is able to achieve very high speed with the maximum accuracy and measurement repeatability, the X and Y axes utilize roller bearings and powerful brushless motors coupled with pre-loaded, high precision ball screws to move the eight measurement probes.

All of Seica’s systems are based on the VIP platform (Viva Integrated Platform) and include the technologically advanced hardware and software capabilities, in a completely integrated, user-friendly environment, which provide the high-level test performances required by today’s electronics.

Seica’s VIVA Next> 64-bit provides intelligent integration with all aspects of the customer’s manufacturing processes – data collection, traceability, interaction with MES, repair operations – and all of the Next> series systems have Canavisia’s Industrial Monitoring solution on board, with the potential for remote monitoring of current and voltage consumption, mains supply, temperature, light indicators and other parameters useful to indicate correct operation, provide information for predictive maintenance and, in general, to render the systems compatible with today’s Industry 4.0 standards.

Seica, with more than 25 years’ experience as a leader in Flying Probe technology, presents, at booth 5240, modern flying probe solutions, fully automated to meet smart factory standards, and deeply oriented to handle the daily changes of products and manufacturing changeovers demanded by almost every market.