The New LASER selective soldering Firefly Next < series was presented in the booth A3-337, Seica Automation booth, a piece of jewelry in engineering, featuring an attractive, stylish and renewed appearance if compared to the Firefly version available on the market for over ten years, but capable of providing an outstanding Technological leap. Under the new shiny and bright “dress” made of steel and other prestigious materials, the Firefly next  series combines its 4 essential innovations: new high-efficiency LASER source, new spot angle on the board to be soldered, fully-programmable donut spot and perfect axial integration of the LASER generation, vision and temperature feedback of the solder joint, all to provide an outstanding throughput in terms of applicability and reliability of this solution, if compared to the past generation and current competitors.